Showing posts with label JEDEC. Show all posts
Showing posts with label JEDEC. Show all posts

Thursday, December 12, 2019

Everspin achieves data center OEM qualification of its 1Gb STT-MRAM offering; announces production shipments

Everspin Technologies announced on Wednesday that it has secured the qualification notice from a major server OEM of its 1-Gigabit (Gb) Spin-transfer Torque Magnetoresistive Random Access Memory (STT-MRAM) device. This qualification notice affirms the quality, performance and specifications of the 1Gb device and enables its use in the production of products for this customer. 


The STT-MRAM provides a significant reduction in switching energy compared to Toggle MRAM, and is highly scalable, enabling higher density memory products. Everspin’s third generation of MRAM technology uses a Perpendicular MTJ, and has developed materials and Perpendicular MTJ stack designs with high perpendicular magnetic anisotropy, which provides long data retention, small cell size, greater density, high endurance and low power.

The 1Gb is the newest generation of STT-MRAM, utilizing ST-DDR4 which is a JEDEC-like DDR4 interface with some modifications needed to take advantage of the persistence from MRAM technology. These products perform like a persistent DRAM but with no refresh required. Additional products are planned which will utilize high speed serial interfaces for a range of embedded applications.


Earlier this summer, Everspin announced pilot manufacturing of its 28 nm 1Gb device and is now qualified to make production shipments to its first qualifying customer. 

No other manufacturer has achieved production of any discrete STT-MRAM device, a further testament to Everspin’s position in the field having achieved production of its 256Mb STT-MRAM in 2017. To date, Everspin has produced more than 120 million units of its Toggle and STT-MRAM devices.

Everspin’s STT-MRAM devices allow enterprise infrastructure and data center providers to increase the reliability and performance of systems where low latency data persistence is critical. This is achieved by delivering protection against power loss and allowing storage OEMs to significantly improve quality of service of their products. 

Similar benefits can also be achieved using the 1Gb STT-MRAM device as a persistent data write buffer in storage and fabric accelerators, computational storage, and other applications.


The data center OEM name is not being disclosed as they have not yet announced their end product(s).

“We continue to make great strides in the commercialization of MRAM across many market segments, including the data center,” said Kevin Conley, president and CEO of Everspin. “It is very rewarding to see the completion of this very important customer milestone with our 1Gb STT-MRAM, along with the collaboration that has taken place with our customers and our ecosystem partners.”

Saturday, November 16, 2019

KIOXIA America debuts initial 512GB automotive UFS that advances systems and applications for autonomous vehicles

KIOXIA America, formerly Toshiba Memory America, announced that it has begun sampling its 512 gigabyte (GB) Automotive Universal Flash Storage (UFS) JEDEC Version 2.1 embedded memory solution. 

KIOXIA America’s Automotive UFS supports a wide temperature range (-40°C to +105°C), meets AEC-Q100 Grade24 requirements, and offers the extended reliability required by various automotive applications. The 512GB device joins the company’s existing lineup of automotive UFS, which includes capacities of 16GB, 32GB, 64GB, 128GB and 256GB.



To meet this demand for large-capacity memory, KIOXIA’s new 512GB Automotive UFS memory was developed, which integrates the company’s BiCS FLASH 3D flash memory and a controller in a single package. 512GB Automotive UFS features several functions ideal to the requirements of automotive applications including Refresh, Thermal Control and Extended Diagnosis. 


The Refresh function can be used to refresh data stored in UFS and helps extend the data’s lifespan. The Thermal Control function protects the device from overheating in the high-temperature circumstances that can occur in automotive applications. Lastly, the Extended Diagnosis function helps the host processor understand the device’s status.

Innovations such as autonomous vehicles, more advanced infotainment systems, digital clusters, telematics, and ADAS provide not only an elevated driver experience but also a greater demand for storage within vehicles.

Masimo secures FDA clearance for neonatal RD SET Pulse Oximetry sensors with improved accuracy specifications

Masimo announced that RD SET sensors with Masimo Measure-through Motion and Low Perfusion SET pulse oximetry have received FDA clearance ...