Showing posts with label interconnect. Show all posts
Showing posts with label interconnect. Show all posts

Thursday, November 21, 2019

Ambient Scientific debuts DigAn (Digital Analog) AI technology to boost performance and efficiency

Ambient Scientific released its initial Digital Analog (DigAn) AI technology with demonstration of its first DigAn AI processor chip at the Edge AI Summit. 

DigAn AI is an advanced version of Analog AI technology that provides ultra-high performance and efficiency of Analog AI with implementation and commercial advantages of Digital chips. The company also announced low-power on-device AI solution for ‘Wake on Word’ applications.


Ambient Scientific’s DigAn AI Processor is built with multiple fundamental grass root level innovations. These include Analog Matrix Compute Engine using DigAn technology, that performs blazingly fast arithmetic computations with improved power efficiency, ultra-low power embedded SRAM for critical storage, and ultra-low power on-chip interconnect technology that enables massive parallel processing.

Ambient’s DigAn AI Processor computes an entire layer of neurons in a single clock cycle using custom Analog techniques, a task that takes several hundreds or even thousands of clock cycles in traditional implementations. However, DigAn technology uses standard digital transistors to implement its analog functions.

Experts agree that Analog is a great fit for AI computing. However, prior implementations had severe limitations in accuracy and computing range – two important parameters for optimal AI solution. Ambient has eliminated these limitations. 

While prior implementations have struggled to achieve 8-bit accuracy, Ambient’s DigAn (Digital Analog) technology can achieve 32-bit accuracy. This is 16 million times more accurate in computer language.

HPE, Cray release comprehensive HPC and AI offerings optimized for exascale computing on premises, in the cloud, or as-a-service

Hewlett Packard Enterprise (HPE) announced Thursday that it will deliver comprehensive high-performance computing (HPC) and Artificial Intelligence (AI) portfolio for the exascale era, which is characterized by explosive data growth and new converged workloads such as HPC, AI, and analytics.


The addition of Cray Inc., which HPE recently acquired, bolsters HPE’s HPC and AI solutions to now encompass an end-to-end supercomputing architecture across compute, interconnect, software, storage and services, delivered on premises, hybrid or as-a-Service. Now every enterprise can leverage the same foundational HPC technologies that power the world’s fastest systems, and integrate them into their data centers to unlock insights and fuel new discovery.


Digital transformation is driving new data-intensive workloads and real-time analytics operating at an unprecedented scale. New software, compute, interconnect, and storage capabilities are required for customers to unlock the potential of their data and accelerate innovation. 


HPE delivers solutions for any experience from single, small systems all the way to exascale-class supercomputers with tailored software, interconnect and storage capabilities. This includes solutions for modeling and simulation in weather forecasting, manufacturing and energy sectors, and AI and big data analytics in precision medicine, autonomous vehicles, geospatial imaging and financial services.

Masimo secures FDA clearance for neonatal RD SET Pulse Oximetry sensors with improved accuracy specifications

Masimo announced that RD SET sensors with Masimo Measure-through Motion and Low Perfusion SET pulse oximetry have received FDA clearance ...