ATP Electronics unveiled Tuesday its next-generation A600Si and A600Sc Serial ATA solid state drives (SATA SSDs) featuring a completely new design of the power loss protection (PLP) array, which utilizes a new power management IC (PMIC) and new firmware-programmable MCU (microcontroller unit).
Integrated into its latest PLP technology, ATP PowerProtector 4, the new MCU design allows the PLP array to perform intelligently in various temperatures, power glitches and charge states.
ATP SATA SSDs with the new PowerProtector 4 MCU-based design provide enhanced device protection that suppresses power-up inrush current according to customer request and input over-voltage protection to prevent damage to the SSD circuitry. It delivers improved data integrity using input power noise de-glitch to prevent incorrect cache flushing caused by false triggers such as noisy or unstable host input voltage, and under-charge/over-charge protection for hold-up power capacitors.
It also provides fast power on/off control that cuts time required from power-off to re-power on the SSD; precise control of reset signal generation and power up/down sequences prevents potential issues in the power up/down of the SSD; and industrial operating temperature support ensures reliable operation in extreme environments from ‑40°C to 85°C.
As components perform and react differently in severely cold or hot scenarios, ATP PowerProtector 4 ensures reliable PLP capacitance in all states of cold start, hot temperature workload, and cross temperature.
With this line of SSDs, users get access to RAID support that ensures redundancy and fault tolerance to prevent data loss in the event of a drive failure; end-to-end data protection prevents unauthorized access to data while it is being transferred from one storage device to another; and customization options, as the new MCU-based design allows PLP capabilities to be tailor-fitted according to unique customer requirements, application-specific needs, or use cases.
"Superior power loss protection is essential in any embedded/industrial application. But not all PLPs are equal," said Marco Mezger, ATP vice president of global marketing. "By implementing this type of MCU design, we are able to showcase our engineering expertise and nearly 30-year experience in the design and manufacture of storage devices for wide temperature environments, particularly for compact form factors in embedded/industrial applications. We continue to blaze the trail, as we were also the first to design and release smaller form factor SSDs such as eUSB and M.2 2242 with an onboard PLP array."
The next-generation ATP SATA SSDs with the new MCU-based design include mSATA, 2.5-inch SSDs and M.2 2242/2280 modules. Available with I-Temp (A600Si) and C-Temp (A600Sc) support, the SSDs come in the following capacities — M.2 2280: 120 to 960 GB; M.2 2242 and mSATA: 120 to 480 GB; 2.5": 120 GB to 1.92 TB.
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